| 项目 | 技术标准 |
备注
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| 层数 | 1-12层 |
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| 材料 | CEM-3,FR-4 | ||
| 板厚 | 0.3mm-3.20mm (12mil-126mil) | ||
| 最小芯板厚 | 0.1mm(4mil) | ||
| 铜厚 | 1/2 oz min;3 oz max. | ||
| 最小线宽/间距 | 0.1mm(4mil) | ||
| 最小钻孔孔径 | 0.25mm(10mil) | ||
| 最小冲孔孔径 | 0.9mm(35mil) | ||
| 公差 | 钻孔孔位 | ±0.075mm(3mil) | |
| 线宽 | ±0.1mm(4mil)或线宽的±20% | ||
| 孔径 | PTH±0.1mm(4mil) NPTH±0.075mm(3mil) |
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| 外型公差 | 铣床±0.15MM(6mil) 冲床±0.10mm(4mil) |
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| 翘曲度 | 0.70%-1% | ||
| 焊盘表面处理 | Nickel/Gold Plating/Entek/Hot Air Leveling | ||
| 绝缘电阻 | 10KΩ-20MΩ | ||
| 传导电阻 | < 50Ω | ||
| 测试电压 | 300V | ||
| V刻 | 拼板尺寸 | 110×100mm(min.) 660×600mm(max.) | |
| 板厚 | 0.6mm(24mil)min. | ||
| 保留厚度 | 0.3mm(12mil)min. | ||
| 公差 | ±0.1mm(4mil) | ||
| 槽宽 | 0.50mm(20mil)max. | ||
| 槽到槽 | 10mm min. | ||
| 槽到线 | 0.50mm(20mil)min. | ||
| 槽 | Slot size tol.>=2W公差 | PTH L:±0.15mm(6mil) W:±0.1mm(4mil) |
Where:L=Slot length W=Slot width Min.drill bit size for multi-drill is 0.7mm |
| NPTH L:±0.125mm(5mil) W:±0.1mm(4mil) |
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| 最小孔到圆形距离 | PTH Hole:0.13mm(5mil) | ||
| NPTH Hole:0.18(7mil) | |||
| Registration Tolerance of Front/Back image | 圆形偏差 | 0.075mm(3mil) | |
| 多层板 | 层间偏差 | 4 layers:0.15mm(6mil)max. | |
| 6 layers:0.025mm(10mil)max. | |||
| 最小孔至内层圆形距离 | 0.25mm(10mil) | ||
| 最小板边到内圆形距离 | 0.25mm(10mil) | ||
| 板厚公差 | 4 layers:±0.13mm(5mil) | ||
| 6 layers:±0.15mm(6mil) | |||
| 特性阻抗 | 60 ohm±10% | ||
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Bao Da Cheng Electronics工艺参数
